DOI number:10.15938/j.emc.2021.12.003

Journal:电机与控制学报

Key Words:伺服电机，多轴伺服驱动，矢量控制，多处理器片上系统，现场可编程门阵列，软硬件协同设计

Co-author:王东,许睿,张文轩,刘庆想

First Author:王邦继

Discipline:Engineering

Volume:25

Issue:12

Page Number:19-26

ISSN No.:1007-449X

Translation or Not:no

CN No.:23-1408/TM

Date of Publication:2021-12-01

Included Journals:EI

Links to published journals:https://kns.cnki.net/kcms2/article/abstract?v=3uoqIhG8C44YLTlOAiTRKibYlV5Vjs7iJTKGjg9uTdeTsOI_ra5_XS3Cxv1BSt47rtZc3lCIvvmg9flCH0_aKlQ3z3bveU9t&uniplatform=NZKPT